3DLABS announces Microsoft Windows CE BSP for its DMS-02 media-rich applications processor
Enabling the rapid introduction of Windows CE devices that take full advantage of the application processing, 2D, 3D, video and imaging acceleration offered by the low-power DMS-02
London, England, 21st February 2008: 3DLABS Semiconductor, a pioneer in media-rich application processors, announces that it will be demonstrating its Windows CE BSP (Board Support Package) at Embedded World, Nuremberg, Germany, 26-28th February. The BSP takes full advantage of the DMS-02's fully programmable media processing array and dual ARM architecture to deliver unrivalled application and media performance for embedded and low-power consumer electronics devices such as connected media players, portable navigation units, service terminals, smartphones and gaming devices.
Manoj Rami, Senior Marketing Manager, Windows Embedded Business Group, Microsoft EMEA. for Microsoft comments: "3DLABS's continued innovation on our platform shows how its market leading approach to providing better and faster processor solutions delivers unrivalled application and media performance in embedded and low-power consumer electronics devices."
The Windows CE 5.0 BSP is supported on the latest DMS-02 Development System, a small footprint connected platform that includes; UI features (800x480 24-bit LCD resistive touch screen, keyboard, mouse, buttons, microphone, headphone, line-in/out and speakers), connectivity (WiFi, USB), storage (2Gbyte NAND, NOR Flash, SDCard, SDHC/MMC+ slot,) and video I/O (HDMI TV encoder, analog TV encoder, VGA Camera).
"This Windows CE 5.0 BSP marks an important milestone in enabling our customers to take advantage of an industry-leading OS to bring feature rich devices to market quickly and efficiently." said Tim Lewis, director marketing, 3DLABS Semiconductor. "By combining our intimate knowledge of our DMS-02 processor with a Windows CE BSP we can jump-start the product development of our customers and partners working in the Microsoft Windows CE eco-system. "
The DMS-02 media-rich applications processor is a multi-core System-On-Chip that combines two ARM® 926 cores with 3DLABS's proprietary SIMD array processor and an industry standard set of peripheral functions. The fully programmable array performs all the media intensive tasks such as 2D/3D graphics, video encode/decode and image processing, offloading the ARMs and leaving them free to run CPU friendly tasks.
The Windows CE 5.0 BSP and supported DMS-02 Development System are expected to ship to partners during Q1 2008.
ZiiLABS is a leader in media-rich application processors, hardware platforms and advanced middleware. Its products enable OEMs, ODMs, System Integrators and Software Developers to deliver industry-leading devices across a broad range of consumer electronics and embedded markets. Originally founded in 1994 as 3DLABS, the company re-branded and joined with the Personal Digital Entertainment group of Creative Technology to form ZiiLABS in January 2009. ZiiLABs with over 800 R&D engineers today has invested US$1billion and 10,000 man years in media processing solutions and has offices in the UK, China, USA and Singapore.
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